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Excellent wetting for both lead-free (SAC305) and leaded (Sn63Pb37) alloys.
Suitable for use in membrane switches and steel dome contact applications. Go to product viewer dialog for this item. IPC-4556 - Amendment 1 ipc4556 pdf
This critical update added a maximum gold thickness of 0.070 µm. This limit prevents "hyper-corrosion" of the nickel, which can occur if the gold plating process is too aggressive or prolonged. Excellent wetting for both lead-free (SAC305) and leaded
IPC-4556 specifies X-ray Fluorescence (XRF) as the primary method for verifying thickness. It mandates the use of Solid State Detectors (SSD) for better resolution on tri-level coatings and requires calibration against national standards. and even copper wire bonding.
High pull strengths for gold, aluminum, and even copper wire bonding.